JPH0532956Y2 - - Google Patents
Info
- Publication number
- JPH0532956Y2 JPH0532956Y2 JP14620587U JP14620587U JPH0532956Y2 JP H0532956 Y2 JPH0532956 Y2 JP H0532956Y2 JP 14620587 U JP14620587 U JP 14620587U JP 14620587 U JP14620587 U JP 14620587U JP H0532956 Y2 JPH0532956 Y2 JP H0532956Y2
- Authority
- JP
- Japan
- Prior art keywords
- nut
- joint
- quartz
- diameter portion
- conductive wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010453 quartz Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 238000007789 sealing Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14620587U JPH0532956Y2 (en]) | 1987-09-24 | 1987-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14620587U JPH0532956Y2 (en]) | 1987-09-24 | 1987-09-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6454294U JPS6454294U (en]) | 1989-04-04 |
| JPH0532956Y2 true JPH0532956Y2 (en]) | 1993-08-23 |
Family
ID=31415477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14620587U Expired - Lifetime JPH0532956Y2 (en]) | 1987-09-24 | 1987-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0532956Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5465828B2 (ja) * | 2007-10-01 | 2014-04-09 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
-
1987
- 1987-09-24 JP JP14620587U patent/JPH0532956Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6454294U (en]) | 1989-04-04 |
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